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Job Description

Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR22170 Wire Bond / Flip Chip Underfill Engineer
As a Wire Bond Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.
Responsibilities and Tasks :
  • Evaluate and Improve Wire Bond Processes, Materials, and/or Equipment Maintain in-depth process knowledge
  • Maintain materials and equipment knowledge as it relates to the process and how they interact
  • Optimize process and/or equipment variables by apply DOE techniques
  • Maintain knowledge of material attributes (shelf life, storage requirements, etc.)
  • Define process edges and center the process (CPK)
  • Determine root cause and implement corrective actions
  • Define and maintain operation procedures

Requirements:
1)Bachelor's orMaster degreein Electronic, Mechanical,Mechatronic or related Engineering
2) Min5 years related experience in Assembly packaging or Semiconductor manufacturing background
3) Possess good knowledge in Wire Bond Processes
5) Familiar with Failure Mode Effects Analysis(FMEA), Statistical Process Control (SPC) and Problem solving skills
6) Knowledge inDesign Of Experiment (DOE) will be an added advantage
7) Self-motivated, possess initiative and ability to work independently
8) Team player with good communication and interpersonal skills
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
Please note that in order to assist in providing a safe and healthy workplace for all Micron team members, new employment offers for jobs based in India, Malaysia, Singapore, and the U.S., are contingent upon the applicant's provision of a copy of their COVID-19 vaccination document to Micron on a confidential basis prior to their scheduled start date confirming that they have completed the COVID-19 vaccination process, subject to any written request for medical or religious accommodation and to the extent permitted by applicable law.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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Job Detail

  • Job Id
    401ccffbe236ecc4
  • Location
    id
  • Company
  • Type
    Private
  • Employment Status
    Permanent
  • Positions
    Available
  • Career Level
    Experience
  • Gender
    Male/Female

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